The wafer thinning process starts after the Electro-less Plating process has done. iST is the only one company capable of combining Electro-less Plating and BGBM, CP, and die processes. With this comprehensive one-stop service, wafers finished with front-end foundry processes can be delivered to iST for die processing service.
Note 1: Refer to JH Lee, IG Lee, T. Kang, NS Kim, and SY OH, The Effects of Bath composition on the Morphologies of Electroless Nickel Under Bump metallurgy on Al Input/Output Pad, Journal of Electronic Materials, Vol. 34, No. 1, (2005).