News

Your IC operation news

Industry news from the laboratories we work with, process, failure analysis, automotive qualification and material analysis.

Latest articles

Process

Electroless plating: the high-value choice for MOSFET FSM

The FSM process includes electroless plating and sputtering deposition. Which process is more mature, more stable and more reliable, and which offers better value?

Read the article, electroless plating for MOSFET FSM

Failure analysis

How to identify the burnt area in an IC EOS case

Components are found burnt out during system assembly and the IC design house blames EOS. As an IC engineer, how do you find out what actually happened?

Read the article, identifying the burnt area in an IC EOS case

Automotive

iST, Changan and Unicore announce the first AEC-Q100 compliant car navigation chip

iST, together with Chinese car manufacturer Changan Automobile and Unicore, announce a qualified navigation chip for the automotive market.

Read the article, the first AEC-Q100 compliant car navigation chip

Material analysis

iST breaks the 10 nm barrier in TEM material analysis

After a year of development, iST pushes material analysis resolution past the 10 nm mark.

Read the article, breaking the 10 nm barrier in TEM material analysis

Equipment

MCC HPB5C now available at iST

In addition to the MCC ABES-V that iST already operates, the MCC HPB5C oven is now in service.

Read the article, the MCC HPB5C oven now available at iST

Packaging

WLCSP backend turnkey service

Yield and throughput issues in WLCSP development, who handles backside grinding, testing, sawing and packing after bumping?

Read the article, WLCSP backend turnkey service

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