Services

The official representative of iST in Israel and Europe

ICleviathan is a leading company in the field of IC qualification. Six capabilities, run end to end, under one accountable partner.

01
Overview

About our services

iST is a verification and test laboratory for the electronics industry, founded in 1994. Its scope covers failure analysis, reliability assurance, material analysis, chemical and process micropollution analysis, and signal integrity testing.

Its customers span the whole spectrum of the electronics industry, from IC design houses to end-product manufacturers, and it serves as an independent quality testing laboratory for outsourced products from international brands.

Responding to cloud intelligence, the Internet of Things and the Internet of Vehicles, iST has expanded beyond its core services into semiconductor advanced-process verification platforms, automotive electronic verification platforms, and IoT/IoV platforms.

The centre of a probe card: several hundred fine gold needles fanning inward from all four sides and converging on a dense square array of contact pads.
Probe card, centre detail, wafer test
02
Capabilities

Six capabilities, at full length

Each one is run end to end by ICleviathan. We hold the agency agreement, the specification and the schedule.

S.01 · iST Taiwan

IC Qualification & Failure Analysis

ICleviathan is the authorised sales agent for iST Taiwan. iST has been accredited by international bodies including IECQ / ISO 17025, TÜV NORD and CNAS, and is used as an independent quality testing laboratory by international brands including TI, Lenovo, Dell, Cisco, Delphi, Continental Automotive, ISTA and HDMI.

  • Reliability assurance, component to system level
  • Automotive qualification, the full AEC-Q family
  • Non-destructive, electrical and physical failure analysis
  • Material analysis and FIB circuit edit
S.02 · iST Taiwan

Board Level Reliability

A component that passes AEC-Q or JESD47 has proved the part. It has not proved the solder joint that attaches it to your board, and that joint is where a great many field returns originate: under thermal expansion mismatch, under a drop, or under the flex of an assembled product.

Daisy-chain test vehicles are cycled, dropped, bent and shaken under continuous event detection, so the moment a joint opens is recorded rather than inferred. Dye-and-pry and cross-section afterwards show which joint failed, and where in the joint it started.

  • Temperature cycling, IPC-9701
  • Board level drop test, JESD22-B111
  • Cyclic bend, JESD22-B113
  • Shock, vibration, dye-and-pry and cross-section
S.03 · CoAsia SEMI

Digital IC Design

ICleviathan is the authorised sales agent for CoAsia, an official Design Solution Partner in Samsung Foundry's SAFE programme. Turnkey services from concept to silicon supply: design services, system architecture, physical design at advanced nodes, OSAT services, packaging including 2.5D, test, RTL and BSP software, quality control, supply chain management, wafer procurement, logistics and product delivery.

  • System architecture
  • Physical design down to the 3 nm node
  • RTL and BSP software
  • OSAT, 2.5D packaging and wafer procurement
S.04 · NanoZeta

Analog & RF Design

ICleviathan is the authorised sales agent for NanoZeta. Analog and mm-wave IC design: full transceiver design, BiCMOS and nm-scale CMOS, PLLs and frequency synthesizers, analog baseband, front-ends, high-speed interfaces and clock distribution.

Process nodes run from 0.18 µm to 5 nm, including FD-SOI and FinFET. Designs already proven in silicon range from short-range wireless at 2.4 GHz up to 76–81 GHz automotive radar front-ends.

  • Full transceiver design
  • PLL and frequency synthesis
  • Analog baseband and RF front-ends
  • High-speed interfaces and clock distribution
S.05 · Vendor selection

IC Assembly

ICleviathan accompanies the customer through the assembly process, selecting the assembly house and the package, using our experience in the field to ensure top service is paired with cost efficiency. We weigh capability, yield risk and unit cost rather than whoever quoted first, and stay on the line through qualification builds.

  • Package selection and definition
  • OSAT qualification
  • Wire bond and flip chip
  • 2.5D and advanced packaging
S.06 · Samples to volume

IC Manufacturing

ICleviathan has the knowledge and the experience to support every stage of the manufacturing cycle, from samples to high-volume production, including the unglamorous part, which is making sure the part still exists and still ships three years from now.

  • Engineering samples
  • Volume ramp
  • Supply chain management
  • Obsolescence and continuity
03
Failure analysis

When the part comes back from the field

Non-destructive first, then electrical, then physical, so evidence is preserved for as long as possible before anything is cut.

An X-ray radiograph looking through a ball grid array package: a regular grid of solder joints surrounding the die, with bond wires fanning out from it.
X-ray radiograph through a BGA package, non-destructive
A polished cross-section through a packaged integrated circuit, showing the moulding compound, the silicon die with its bond wires, the layered substrate beneath it and a row of solder balls along the bottom.
Polished cross-section through the package, destructive
04
Capability index

The complete laboratory capability index

Seven groups, available to our customers through iST.

Reliability Assurance

6 items
  • Component level
  • Board level
  • PCB level
  • PCBA level
  • System level
  • JESD47 consumer electronics qualification

Board Level Reliability

9 items
  • Temperature cycling, board level
  • Board level drop test
  • Cyclic bend
  • Monotonic bend
  • Mechanical shock
  • Vibration
  • Strain gauge characterisation
  • Daisy-chain event detection
  • Dye-and-pry analysis

Automotive Components Qualification

6 items
  • AEC-Q100 ICs
  • AEC-Q101 discrete
  • AEC-Q102 LED
  • AEC-Q104 MCM
  • AEC-Q200 passive
  • AEC-Q001–005 quality

Failure Analysis

4 items
  • Non-destructive FA
  • Electrical FA
  • Physical FA
  • Reverse engineering

Engineering Sample Preparation

8 items
  • Decapsulation
  • De-layer
  • Cross-section
  • CP
  • IC backside polishing
  • Digital photographing
  • IC assembly
  • PCB assembly

FIB Circuit Edit

6 items
  • Circuit edit
  • Probe pads / debug
  • CAD navigation
  • N-FIB engineering
  • WLCSP FIB
  • Backside FIB

Surface Process Engineering

3 items
  • Front-side metallization
  • Backside grinding
  • Backside metallization
05
The full IC operations flow

We help you with all your IC flow

ICleviathan has experience and knowledge across the entire flow shown here.

01

Definition

Spec, feasibility, vendor mapping

02

Design

RTL, physical, analog & RF

03

Fabrication

Wafer procurement, foundry

04

Assembly

Package selection, OSAT, 2.5D

05

Test & Qual

CP, FT, JESD47, AEC-Q

06

Production

Ramp, FA, supply chain

Get in touch

Need an expert on your side?

Tell us where the project is and what is blocking it. Iris comes back to you personally, usually the same working day.

Mobile+972 52 725 0175 EmailIris@icleviathan.com
Address6 Ruth St, Ramat Gan, Israel

Contact form

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